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24AA08/24LC08B
8K I2CTM Serial EEPROM
Device Selection Table
Part Number 24AA08 24LC08B Note 1: VCC Range 1.8-5.5 2.5-5.5 Max Clock Frequency 400 kHz(1) 400 kHz Temp Ranges I I, E
Description:
The Microchip Technology Inc. 24AA08/24LC08B (24XX08*) is a 8 Kbit Electrically Erasable PROM. The device is organized as four blocks of 256 x 8-bit memory with a 2-wire serial interface. Low voltage design permits operation down to 1.8V, with standby and active currents of only 1 A and 1 mA, respectively. The 24XX08 also has a page write capability for up to 16 bytes of data. The 24XX08 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages, and is also available in the 5-lead SOT-23 package.
100 kHz for VCC <2.5V
Features:
* Single supply with operation down to 1.8V * Low-power CMOS technology: - 1 mA active current, typical - 1 A standby current, typical (I-temp) * Organized as 4 blocks of 256 bytes (4 x 256 x 8) * 2-wire serial interface bus, I2CTM compatible * Schmitt Trigger inputs for noise suppression * Output slope control to eliminate ground bounce * 100 kHz (<2.5V) and 400 kHz (2.5V) compatibility * Self-timed write cycle (including auto-erase) * Page write buffer for up to 16 bytes * 2 ms typical write cycle time for page write * Hardware write-protect for entire memory * Can be operated as a serial ROM * Factory programming (QTP) available * ESD protection > 4,000V * 1,000,000 erase/write cycles * Data retention > 200 years * 8-lead PDIP, SOIC, TSSOP, DFN and MSOP packages * 5-lead SOT-23 package * Standard and Pb-free finishes available * Available for extended temperature ranges: - Industrial (I): -40C to +85C - Automotive (E): -40C to +125C
Block Diagram
WP HV Generator
I/O Control Logic
Memory Control Logic
XDEC
EEPROM Array Page Latches
I/O
SCL
YDEC
SDA VCC VSS Sense Amp. R/W Control
Package Types
PDIP, MSOP A0 A1 A2 VSS 1 2 3 4 SOT-23-5 SCL Vss SDA Note: 1 2 3 4 Vcc 5 WP A0 1 A1 2 A2 3 VSS 4 8 7 6 5 VCC WP SCL A0 A1 A2 SOIC, TSSOP 1 2 3 4 DFN 8 VCC 7 WP 6 SCL 5 SDA 8 7 6 5 VCC WP SCL SDA
SDA VSS
Pins A0, A1 and A2 are not used by the 24XX08. (No internal connections).
*24XX08 is used in this document as a generic part number for the 24AA08/24LC08B devices.
(c) 2005 Microchip Technology Inc.
DS21710D-page 1
24AA08/24LC08B
Package TypeElectrical Characteristics Absolute Maximum Ratings ()
VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature with power applied ................................................................................................-65C to +125C ESD protection on all pins ...................................................................................................................................................... 4 kV NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
VCC = +1.8V to +5.5V Industrial (I): TA = -40C to +85C Automotive (E): TA = -40C to +125C Min
--
DC CHARACTERISTICS Param. Symbol No. D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 VIH -- VIL VHYS VOL ILI ILO CIN, COUT ICC read ICCS Standby current
Characteristic WP, SCL and SDA pins High-level input voltage Low-level input voltage Hysteresis of Schmitt Trigger inputs Low-level output voltage Input leakage current Output leakage current Pin capacitance (all inputs/outputs)
Typ -- -- -- -- -- -- -- -- 0.1 0.05 0.01 --
Max -- -- 0.3 VCC -- 0.40 1 1 10 3 1 1 5
Units -- V V V V A A pF mA mA A A -- -- -- (Note)
Conditions
0.7 VCC -- 0.05 VCC -- -- -- -- -- -- -- --
IOL = 3.0 mA, VCC = 2.5V VIN = .1V to VCC VOUT = .1V to VCC VCC = 5.0V (Note) TA = 25C, FCLK = 1 MHz VCC = 5.5V, SCL = 400 kHz -- Industrial Automotive SDA = SCL = VCC WP = VSS
ICC write Operating current
Note:
This parameter is periodically sampled and not 100% tested.
DS21710D-page 2
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
TABLE 1-2: AC CHARACTERISTICS
VCC = +1.8V to +5.5V Industrial (I): TA = -40C to +85C Automotive (E): TA = -40C to +125C Min -- -- 600 4000 1300 4700 -- -- -- 600 4000 600 4700 0 100 250 600 4000 -- -- 1300 4700 Typ -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 400 100 -- -- -- -- 300 1000 300 -- -- -- -- -- -- -- -- -- 900 3500 -- -- Units kHz ns ns ns Conditions 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) 2.5V VCC 5.5V (Note 1) 1.8V VCC < 2.5V (24AA08) (Note 1) (Note 1) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) (Note 2) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) 2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) AC CHARACTERISTICS Param. Symbol No. 1 2 3 4 FCLK
THIGH
Characteristic Clock frequency Clock high time Clock low time SDA and SCL rise time (Note 1) SDA and SCL fall time Start condition hold time Start condition setup time Data input hold time Data input setup time Stop condition setup time Output valid from clock (Note 2) Bus free time: Time the bus must be free before a new transmission can start Output fall time from VIH minimum to VIL maximum Input filter spike suppression (SDA and SCL pins) Write cycle time (byte or page) Endurance
TLOW TR
5 6 7 8 9 10 11 12
TF THD:STA TSU:STA THD:DAT TSU:DAT TSU:STO TAA TBUF
ns ns ns ns ns ns ns ns
13
TOF
20+0.1CB -- --
-- -- --
250 250 50
ns
2.5V VCC 5.5V 1.8V VCC < 2.5V (24AA08) (Notes 1 and 3)
14
TSP
ns
15 16 Note 1: 2: 3: 4:
TWC --
-- 1M
-- --
5 --
ms
--
cycles 25C, (Note 4)
Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total EnduranceTM Model which can be obtained from Microchip's web site: www.microchip.com.
(c) 2005 Microchip Technology Inc.
DS21710D-page 3
24AA08/24LC08B
FIGURE 1-1: BUS TIMING DATA
5 3 SCL 7 SDA IN 6 14 11 SDA OUT 12 8 9 10 4
2
FIGURE 1-2:
BUS TIMING START/STOP
D4
SCL 7 SDA 6 10
Start
Stop
DS21710D-page 4
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
2.0 FUNCTIONAL DESCRIPTION
3.4 Data Valid (D)
The 24XX08 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, while a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX08 works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of the data bytes transferred between the Start and Stop conditions is determined by the master device and is theoretically unlimited, although only the last sixteen will be stored when doing a write operation. When an overwrite does occur it will replace data in a first-in firstout (FIFO) fashion.
3.0
BUS CHARACTERISTICS
The following bus protocol has been defined: * Data transfer may be initiated only when the bus is not busy. * During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 2-1).
3.5
Acknowledge
Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Note: The 24XX08 does not generate any Acknowledge bits if an internal programming cycle is in progress.
3.1
Bus Not Busy (A)
Both data and clock lines remain high.
3.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition.
3.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition.
The device that acknowledges, has to pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24XX08) will leave the data line high to enable the master to generate the Stop condition.
FIGURE 3-1:
(A) SCL
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B) (D) (D) (C) (A)
SDA
Start Condition
Address or Acknowledge Valid
Data Allowed to Change
Stop Condition
(c) 2005 Microchip Technology Inc.
DS21710D-page 5
24AA08/24LC08B
3.6 Device Addressing
FIGURE 3-2:
Start A control byte is the first byte received following the Start condition from the master device (Figure 2-2). The control byte consists of a four-bit control code. For the 24XX08, this is set as `1010' binary for read and write operations. The next three bits of the control byte are the block-select bits (B2, B1, B0). B2 is a "don't care" for the 24XX08. They are used by the master device to select which of the four 256 word-blocks of memory are to be accessed. These bits are in effect the three Most Significant bits of the word address. The last bit of the control byte defines the operation to be performed. When set to `1' a read operation is selected. When set to `0' a write operation is selected. Following the Start condition, the 24XX08 monitors the SDA bus, checking the device type identifier being transmitted and, upon receiving a `1010' code, the slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX08 will select a read or write operation. Operation Read Write Control Code Block Select Block Address Block Address R/W
CONTROL BYTE ALLOCATION
Read/Write SLAVE ADDRESS R/W A
1
0
1
0
x
B1
B0
x = "don't care"
1010 1010
1 0
DS21710D-page 6
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
4.0
4.1
WRITE OPERATION
Byte Write
4.2
Page Write
Following the Start condition from the master, the device code (4 bits), the block address (3 bits) and the R/W bit, which is a logic-low, is placed onto the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow once it has generated an Acknowledge bit during the ninth clock cycle. Therefore, the next byte transmitted by the master is the word address and will be written into the address pointer of the 24XX08. After receiving another Acknowledge signal from the 24XX08, the master device will transmit the data word to be written into the addressed memory location. The 24XX08 acknowledges again and the master generates a Stop condition. This initiates the internal write cycle and, during this time, the 24XX08 will not generate Acknowledge signals (Figure 3-1).
The write control byte, word address and the first data byte are transmitted to the 24XX08 in the same way as in a byte write. However, instead of generating a Stop condition, the master transmits up to 16 data bytes to the 24XX08, which are temporarily stored in the onchip page buffer and will be written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the four lower-order address pointer bits are internally incremented by `1'. The higher-order 7 bits of the word address remain constant. If the master should transmit more than 16 words prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received an internal write cycle will begin (Figure 3-2). Note: Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or `page-size') and end at addresses that are integer multiples of [page size - 1]. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary.
FIGURE 4-1:
BUS ACTIVITY MASTER
BYTE WRITE
S T A R T S A C K A C K A C K Control Byte Word Address S T O P P
Data
SDA LINE BUS ACTIVITY
FIGURE 4-2:
BUS ACTIVITY MASTER SDA LINE BUS ACTIVITY
PAGE WRITE
S T A R T S A C K A C K A C K A C K A C K Control Byte Word Address (n) S T O P P
Data (n)
Data (n + 1)
Data (n + 15)
(c) 2005 Microchip Technology Inc.
DS21710D-page 7
24AA08/24LC08B
5.0 ACKNOWLEDGE POLLING 6.0 WRITE PROTECTION
Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle and ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0). If the device is still busy with the write cycle, no ACK will be returned. If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 4-1 for a flow diagram of this operation. The 24XX08 can be used as a serial ROM when the WP pin is connected to VCC. Programming will be inhibited and the entire memory will be write-protected.
FIGURE 5-1:
ACKNOWLEDGE POLLING FLOW
Send Write Command
Send Stop Condition to Initiate Write Cycle
Send Start
Send Control Byte with R/W = 0
Did Device Acknowledge (ACK = 0)? Yes Next Operation
No
DS21710D-page 8
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
7.0 READ OPERATION
7.3 Sequential Read
Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the slave address is set to `1'. There are three basic types of read operations: current address read, random read and sequential read. Sequential reads are initiated in the same way as a random read, except that once the 24XX08 transmits the first data byte, the master issues an acknowledge as opposed to a Stop condition in a random read. This directs the 24XX08 to transmit the next sequentiallyaddressed 8-bit word (Figure 6-3). To provide sequential reads, the 24XX08 contains an internal address pointer that is incremented by one upon completion of each operation. This address pointer allows the entire memory contents to be serially read during one operation.
7.1
Current Address Read
The 24XX08 contains an address counter that maintains the address of the last word accessed, internally incremented by `1'. Therefore, if the previous access (either a read or write operation) was to address n, the next current address read operation would access data from address n + 1. Upon receipt of the slave address with R/W bit set to `1', the 24XX08 issues an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer but does generate a Stop condition and the 24XX08 discontinues transmission (Figure 6-1).
7.4
Noise Protection
The 24XX08 employs a VCC threshold detector circuit which disables the internal erase/write logic if the VCC is below 1.5V at nominal conditions. The SCL and SDA inputs have Schmitt Trigger and filter circuits which suppress noise spikes to assure proper device operation, even on a noisy bus.
7.2
Random Read
Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is accomplished by sending the word address to the 24XX08 as part of a write operation. Once the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set. The master then issues the control byte again, but with the R/W bit set to a `1'. The 24XX08 will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer but does generate a Stop condition and the 24XX08 will discontinue transmission (Figure 6-2).
FIGURE 7-1:
CURRENT ADDRESS READ
BUS ACTIVITY MASTER S T A R T S A C K N O A C K Control Byte S T O P P
Data (n)
SDA LINE BUS ACTIVITY
(c) 2005 Microchip Technology Inc.
DS21710D-page 9
24AA08/24LC08B
FIGURE 7-2: RANDOM READ
S T A R T S Control Byte Word Address (n) S T A R T S A C K A C K A C K N O A C K Control Byte S T O P P
BUS ACTIVITY MASTER
Data (n)
SDA LINE BUS ACTIVITY
FIGURE 7-3:
BUS ACTIVITY MASTER SDA LINE BUS ACTIVITY
SEQUENTIAL READ
Control Byte S T O P P A C K A C K A C K A C K N O A C K
Data (n)
Data (n + 1)
Data (n + 2)
Data (n + X)
DS21710D-page 10
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
8.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 7-1.
TABLE 8-1:
Name A0 A1 A2 VSS SDA SCL WP VCC
PIN FUNCTION TABLE
PDIP 1 2 3 4 5 6 7 8 SOIC 1 2 3 4 5 6 7 8 TSSOP 1 2 3 4 5 6 7 8 DFN 1 2 3 4 5 6 7 8 MSOP 1 2 3 4 5 6 7 8 SOT-23 -- -- -- 2 3 1 5 4 Description Not Connected Not Connected Not Connected Ground Serial Address/Data I/O Serial Clock Write-Protect Input +1.8V to 5.5V Power Supply
8.1
Serial Address/Data Input/Output (SDA)
8.3
Write-Protect (WP)
The WP pin must be connected to either VSS or VCC. If tied to VSS, normal memory operation is enabled (read/write the entire memory 00-03FFH). If tied to VCC, write operations are inhibited. The entire memory will be write-protected. Read operations are not affected. This feature allows the user to use the 24XX08 as a serial ROM when WP is enabled (tied to VCC).
SDA is a bidirectional pin used to transfer addresses and data into and out of the device. Since it is an opendrain terminal, the SDA bus requires a pull-up resistor to VCC (typical 10 k for 100 kHz, 2 k for 400 kHz). For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating Start and Stop conditions.
8.2
Serial Clock (SCL)
8.4
A0, A1, A2
The SCL input is used to synchronize the data transfer to and from the device.
The A0, A1 and A2 pins are not used by the 24XX08. They may be left floating or tied to either VSS or VCC.
(c) 2005 Microchip Technology Inc.
DS21710D-page 11
24AA08/24LC08B
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW Example: 24LC08B I/P13F 0527
8-Lead SOIC (150 mil) XXXXXXXX T/XXYYWW NNN
Example: 24LC08B I/SN0527 13F
8-Lead TSSOP XXXX TYWW NNN 8-Lead MSOP XXXXXT YWWNNN
Example: 4L08 I527 13F
Device TSSOP/MSOP Marking Codes STD 24AA08 24LC08B 4A08 4L08 Pb-free G4A8 G4L8
Example: 4L08BI Y52713F
5-Lead SOT-23
Example:
Device
SOT-23 Marking Codes STD Pb-free B4 M4 N4
XXNN
M43F
24AA08 24LC08B-I 24LC08B-E Note:
B4 M4 N4
Pb-free part number using "G" suffix is marked on carton
DS21710D-page 12
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
8-Lead 2x3 DFN
XXX YWW NN
Example:
244 527 13
Legend: XX...X T Y YY WW NNN
e3
Note:
Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn)
For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
Note:
Note:
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
(c) 2005 Microchip Technology Inc.
DS21710D-page 13
24AA08/24LC08B
8-Lead Plastic Dual In-line (P) - 300 mil (PDIP)
E1
D 2 n 1 E
A
A2
c
L A1
eB
B1 p B
Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB
MIN
INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10
MAX
MIN
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15
MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
MAX
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018
DS21710D-page 14
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC)
E E1
p
D 2 B n 1
h 45
c A A2
L A1
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D h L c B
MIN
.053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0
INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12
MAX
MIN
.069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15
MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12
MAX
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057
(c) 2005 Microchip Technology Inc.
DS21710D-page 15
24AA08/24LC08B
8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP)
E E1 p
D 2 1 n B
A c
L
A1
A2
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B
MIN
INCHES NOM 8 .026
MAX
MIN
.033 .002 .246 .169 .114 .020 0 .004 .007 0 0
.035 .004 .251 .173 .118 .024 4 .006 .010 5 5
.043 .037 .006 .256 .177 .122 .028 8 .008 .012 10 10
MILLIMETERS* NOM MAX 8 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086
DS21710D-page 16
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E E1
p D 2 B n 1
A c A1 (F)
A2
L
8 Number of Pins Pitch .026 BSC A .043 Overall Height A2 Molded Package Thickness .030 .033 .037 A1 .000 .006 Standoff E Overall Width .193 TYP. E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .031 Foot Length Footprint (Reference) F .037 REF 0 8 Foot Angle c .003 .006 .009 Lead Thickness B .009 .012 .016 Lead Width 5 15 Mold Draft Angle Top 5 15 Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Units Dimension Limits n p
MIN
INCHES NOM
MAX
MIN
MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0 0.08 0.22 5 5 -
MAX
1.10 0.95 0.15
0.80 8 0.23 0.40 15 15
JEDEC Equivalent: MO-187
Drawing No. C04-111
(c) 2005 Microchip Technology Inc.
DS21710D-page 17
24AA08/24LC08B
5-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E E1
p B p1 D
n
1
c A A2
L
A1
Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L Foot Angle c Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic B
MIN
INCHES* NOM 5 .038 .075 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5
MAX
MIN
.035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0
.057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10
MILLIMETERS NOM 5 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5
MAX
1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091
DS21710D-page 18
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) - Saw Singulated
p D b
n
L
E
E2
PIN 1 ID INDEX AREA (NOTE 2)
EXPOSED METAL PAD
D2
2
1
TOP VIEW
BOTTOM VIEW
A A3
A1
EXPOSED TIE BAR (NOTE 1)
Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Exposed Pad Length Overall Width Exposed Pad Width Contact Width Contact Length
Units Dimension Limits n p A A1 A3 D D2 E E2 b L
MIN
.031 .000
(Note 3)
.055 .047 .008 .012
(Note 3)
INCHES NOM 8 .020 BSC .035 .001 .008 REF. .079 BSC -.118 BSC -.010 .016
MAX
MIN
.039 .002
0.80 0.00
.064 .071 .012 .020
1.39 1.20 0.20 0.30
MILLIMETERS* NOM 8 0.50 BSC 0.90 0.02 0.20 REF. 2.00 BSC -3.00 BSC -0.25 0.40
MAX
1.00 0.05
1.62 1.80 0.30 0.50
*Controlling Parameter Notes: 1. Package may have one or more exposed tie bars at ends. 2. Pin 1 visual index feature may vary, but must be located within the hatched area. 3. Exposed pad dimensions vary with paddle size. 4. JEDEC equivalent: MO-229
Drawing No. C04-123 Revised 05/24/04
(c) 2005 Microchip Technology Inc.
DS21710D-page 19
24AA08/24LC08B
APPENDIX A:
Revision C Corrections to Section 1.0, Electrical Characteristics. Section 9.1, 24LC08B standard marking code. Revision D Added DFN package.
REVISION HISTORY
DS21710D-page 20
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels: * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com In addition, there is a Development Systems Information Line which lists the latest versions of Microchip's development systems software products. This line also provides information on how customers can receive currently available upgrade kits. The Development numbers are: Systems Information Line
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.
1-800-755-2345 - United States and most of Canada 1-480-792-7302 - Other International Locations
(c) 2005 Microchip Technology Inc.
DS21710D-page 21
24AA08/24LC08B
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: 24AA08/24LC08B Questions: 1. What are the best features of this document? Y N Literature Number: DS21710D FAX: (______) _________ - _________
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21710D-page 22
(c) 2005 Microchip Technology Inc.
24AA08/24LC08B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. Device
X
/XX
X
Examples: a) b) 24AA08-I/P: Industrial Temperature,1.8V, PDIP package 24AA08-I/SN: Industrial Temperature,1.8V, SOIC package 24AA08T-I/OT: Industrial Temperature, 1.8V, SOT-23 package, Tape and Reel
Temperature Package Range
24AA08: 24AA08T: I2C
Lead Finish
= 1.8V, 16 Kbit Serial EEPROM = 1.8V, 16 Kbit I2C Serial EEPROM (Tape and Reel) 24LC08B: = 2.5V, 16 Kbit I2C Serial EEPROM 24LC08BT: = 2.5V, 16 Kbit I2C Serial EEPROM (Tape and Reel) Temperature I Range: E Package: P SN ST MC MS OT = -40C to +85C = -40C to +125C = = = = = = Plastic DIP (300 mil body), 8-lead Plastic SOIC (150 mil body), 8-lead Plastic TSSOP (4.4 mm), 8-lead 2x3 DFN, 8-lead Plastic Micro Small Outline (MSOP), 8-lead SOT-23, 5-lead (Tape and Reel only) Standard 63% / 37% SnPb Matte Tin (Pure Sn)
c)
d) e) f) g) h)
24LC08B-I/P: Industrial Temperature, 2.5V, PDIP package 24LC08B-E/SN: Automotive Temp.,2.5V SOIC package 24LC08BT-I/OT: Industrial Temperature, 2.5V, SOT-23 package, Tape and Reel 24LC08B-I/PG: Industrial Temperature, 2.5V, PDIP package, Pb-free 24LC08BT-I/SNG: Industrial Temperature, 2.5V, SOIC package, Tape and Reel, Pb-free
Lead Finish
Blank = G =
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
(c) 2005 Microchip Technology Inc.
DS21710D-page 23
24AA08/24LC08B
NOTES:
DS21710D-page 24
(c) 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2005 Microchip Technology Inc.
DS21710D-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westford, MA Tel: 978-692-3848 Fax: 978-692-3821 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205
ASIA/PACIFIC
India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459
EUROPE
Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820
10/20/04
DS21710D-page 26
(c) 2005 Microchip Technology Inc.

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